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Contamination of Electronic Assemblies by Elissa M. Bumiller, David A. Douthit, Joan Pecht

By Elissa M. Bumiller, David A. Douthit, Joan Pecht

Michael Pecht, Elissa M. Bumiller, and Joan Pecht (all: U. of Maryland-College Park) and David A. Douthit (with a personal corporation) offer info for making a choice on, mitigating, and dealing with illness in digital units at phases starting from the manufacture of the glass fibers utilized in the laminates to the entire meeting of the completed product. Their step by step technique publications readers to the precise quarter and recommend the suitable inquiries to ask. They write for layout approach, reliability, process, and box engineers; caliber insurance managers and scholars; revenues representatives; technicians; creation employees; and security representatives.

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Cross-contamination of plating tanks due to poor rinsing can occur and degrade the quality of the electrodeposits. This can be caused by insufficient rinse times or by inadequate turnover of immersion rinse tanks. Fresh spray rinses that follow immersion rinses are most beneficial, especially during the metallization operation prior to entry in plating baths. The purity of the rinse water is crucial; tap water contains many impurities that interfere with electroplating [4]. Metals used as anode material for electroplating are also a potential source of contamination.

The triple-layered bags used for storing sterilized foods, although expensive, offer one of the best protections. These consist of an outer layer of polyethylene, an inner layer of polyolefine, and in between, a thin layer of aluminum. These bags can be heat-sealed without any deterioration of the printed circuits inside. The only disadvantage of these bags is that they are not transparent, so a good labeling system is essential. If a printed circuit manufacturer goes to the expense of providing such packaging, the assembly plant can use the same bags after inspection and before assembly.

Metals used as anode material for electroplating are also a potential source of contamination. Anode impurities may become co-deposited and result in a contaminated electrodeposit. Other potential contaminant sources are foreign metals from poorly designed or maintained metal racks used for plating, and impurities in the air, especially oil from compressors used for agitating the plating baths. 6 Electroless and Immersion Plating Electroless plating uses no electrical currents to transfer metals.

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